Innovium to Showcase TERALYNX™ 12.8T Switch Silicon along with a Range of Switch System Solutions and SONIC/SAI support at the 2018 OCP U.S. Summit 2018 in San Jose, California
Innovium and partner reference design and software solutions to enable rapid industry deployment of 12.8Tbps switching and PAM-4 based optics
San Jose, CA – March 20, 2018 – Innovium, Inc. a leading provider of networking solutions for data centers, will be an exhibitor (booth C3) and will also host a private meeting room at the Open Compute Project U.S. Summit in San Jose, California, March 20th – 21st, 2018.
Innovium will be showcasing the following at the Summit:
- TERALYNX™ 12.8 Tbps Switch Silicon
- Open Source & Standards based software, SONiC and SAI using Innovium SDK
- Range of Single Chip 12.8T & 6.4T Switching Platforms from partners
- Support for 10GbE to 400GbE using QSFP-DD, QSFP56 and QSFP28 connectivity
- PAM-4 based Optics & connectivity solutions from partners
To schedule a private meeting with the Innovium team, please email: [email protected].
Innovium is a provider of high performance, innovative switching silicon solutions for data centers. Innovium TERALYNX™ family delivers software compatible products ranging from 3.2Tbps to 12.8Tbps with unmatched power efficiency, radix, programmability, buffers and low latency. Innovium team members have a highly successful track record in delivering several generations of widely deployed data center products. The company is headquartered in Silicon Valley, California and is backed by leading venture capital firms including Greylock Partners, Walden Riverwood, Capricorn Investment Group, Qualcomm Ventures, S-Cubed Capital and Redline Capital. For more information, please visit: https://innovium.wpengine.com
Innovium and TERALYNX are trademarks of Innovium, Inc. in the United States and/or other countries. All other trademarks are the property of their respective owners.