Key Benefits

  • Scalable Fixed and Modular Systems
  • Single-chip & Multi-chip Systems
  • Highest faceplate and performance density
  • Breakthrough analytics and power efficiency
  • Line-rate programmability
  • Common software across all systems

Examples of “Single-Chip” Systems

Form FactorExample OptionsKey Benefits

1U:
32 x 400G OSFP / QSFP-DD
32   x 400G
64   x 200G
128 x 100G
  • Single chip 12.8T with best perf/W
  • First 400G solution with 50G IO
  • 128 x 100G available with breakout
2U:
64 x 100/200G QSFP
64   x 200G
32   x 400G
128 x 100G
64   x 100G

  • Single chip 12.8T with best perf/W
  • Also delivers 128 x 100G in 2RU
  • Future Proof for 200G with 50G IO
4U:
128 x 100G QSFP
128 x 100G
  • Single chip 128 x 100G solution with best/W, cost and simplified mgmt
  • Leverages existing QSFP28 solutions
2U:
64 x 100/200G OSFP / QSFP-DD
64   x 200G
128 x 100G
  • Highest density switch with 128 x 100G
  • Can leverage existing optics technology
1U:
32 x 100/200G QSFP
32 x 200G
32 x 100G
48 x 25/50G + 8 x 100G
  • Single chip 6.4T with best perf/W
  • Also delivers 64 x 100G in 1RU
  • Future Proof for 200G with 50G IO

Examples of “Multi-Chip” Systems

Form FactorExample OptionsKey Benefits

2U:
64 x 400G OSFP / QSFP-DD
64   x 400G
128 x 200G
256 x 100G
  • Multi-chip 25.6T switch with best perf/W
  • Highest density 100/200/400G switch in 2U
6-8U Chassis:
128 x 400G OSFP / QSFP-DD

12-14U Chassis:
256 x 400G OSFP / QSFP-DD
128 x 400G
256 x 200G
512 x 100G

256   x 400G
512   x 200G
1024 x 100G
  • Uses fewer ASICs – huge savings in cost, power and complexity!

  • Uses fewer ASICs – huge savings in cost, power and complexity!